The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2021
Filed:
Nov. 12, 2013
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Robin Hsin-Kuo Chao, Wappingers Falls, NY (US);
Yunlin Zhang, Wappingers Falls, NY (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 21/95 (2006.01); G01B 11/06 (2006.01); G01N 21/84 (2006.01); G01N 21/956 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G01B 11/0625 (2013.01); G01B 2210/56 (2013.01); G01N 21/8422 (2013.01); G01N 21/956 (2013.01); G01N 2021/8461 (2013.01);
Abstract
Embodiments of the present invention provide an improved method and system for assessing non-uniformity of features in the measurement area (within the beam spot) on a semiconductor structure, (e.g. wafer), such as a non-uniform film thickness. The scattering from non-uniform features is modeled. Post-processing the residual of theoretical and collected spectra is performed to assess a measure of non-uniformity from within an incident spot beam of a spectrum acquisition tool.