The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2021
Filed:
Mar. 16, 2017
Applicant:
Ev Group E. Thallner Gmbh, St. Florian am Inn, AT;
Inventors:
Thomas Wagenleitner, Aurolzmunster, AT;
Thomas Glinsner, St. Florian am Inn, AT;
Harald Zaglmayr, Vocklabruck, AT;
Assignee:
EV Group E. Thallner GmbH, St. Florian am Inn, AT;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B81C 1/00 (2006.01); H01L 21/68 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00357 (2013.01); H01L 21/67092 (2013.01); H01L 21/681 (2013.01); H01L 23/544 (2013.01); H01L 2224/75753 (2013.01);
Abstract
A method for bonding at least three substrates to form a substrate stack, wherein the substrate stack has at least one lowermost substrate a middle substrate, and an upper substrate. The method includes the following steps: aligning the middle substrate to the lowermost substrate and bonding the middle substrate to the lowermost substrate, then aligning the upper substrate and bonding the upper substrate to the middle substrate, wherein the upper substrate is aligned to the lowermost substrate.