The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

Aug. 13, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Matthew Scott Rogers, Mountain View, CA (US);

Roger Curtis, Stockton, CA (US);

Lara Hawrylchak, Gilroy, CA (US);

Canfeng Lai, Fremont, CA (US);

Bernard L. Hwang, Santa Clara, CA (US);

Jeffrey Tobin, Mountain View, CA (US);

Christopher S. Olsen, Fremont, CA (US);

Malcolm Bevan, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/321 (2006.01); H01L 21/28 (2006.01); H01L 21/02 (2006.01); H01L 27/11524 (2017.01);
U.S. Cl.
CPC ...
H01L 29/40114 (2019.08); H01J 37/32357 (2013.01); H01J 37/32422 (2013.01); H01L 21/02247 (2013.01); H01L 21/02252 (2013.01); H01L 21/3211 (2013.01); H01L 27/11524 (2013.01);
Abstract

Embodiments of the disclosure provide an improved apparatus and methods for nitridation of stacks of materials. In one embodiment, a method for processing a substrate in a processing region of a process chamber is provided. The method includes generating and flowing plasma species from a remote plasma source to a delivery member having a longitudinal passageway, flowing plasma species from the longitudinal passageway to an inlet port formed in a sidewall of the process chamber, wherein the plasma species are flowed at an angle into the inlet port to promote collision of ions or reaction of ions with electrons or charged particles in the plasma species such that ions are substantially eliminated from the plasma species before entering the processing region of the process chamber, and selectively incorporating atomic radicals from the plasma species in silicon or polysilicon regions of the substrate.


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