The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Aug. 05, 2019
Applicant:
Kemet Electronics Corporation, Fort Lauderdale, FL (US);
Inventors:
John Bultitude, Simpsonville, SC (US);
Lonnie G. Jones, Simpsonville, SC (US);
Allen Templeton, Simpsonville, SC (US);
Philip M. Lessner, Simpsonville, SC (US);
Assignee:
KEMET Electronics Corporation, Fort Lauderdale, FL (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01); H01L 23/522 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 28/65 (2013.01); H01L 23/481 (2013.01); H01L 23/5223 (2013.01);
Abstract
Provided herein is a module for packaging semiconductors comprising: at least one PDC comprising parallel internal electrodes of alternating polarity with a paraelectric dielectric between adjacent internal electrodes wherein the paraelectric dielectric has a permittivity above 10 to no more than 300; and wherein the PDC forms a capacitor couple with at least one semiconductor.