The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

May. 06, 2019
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventor:

Takashi Karashima, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 23/528 (2006.01); H01L 49/02 (2006.01); H01L 23/34 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 28/60 (2013.01); H01L 23/34 (2013.01); H01L 23/5283 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 25/16 (2013.01); H05K 2201/10015 (2013.01);
Abstract

The terminal pattern TPof the wiring substrate PB has a side Tfacing the terminal pattern TPand the terminal pattern TPof the wiring substrate PB has a side Tfacing the side Tof the terminal pattern TP. The side Tand the side of Tare exposed from the opening portion OPand OPof the solder resist layer SRrespectively, and outer peripheries of terminal patterns TPand TPother than sides Tand Tare not exposed from opening portions OPand OP. The opening portion OPand the opening portion OPare separated from each other. The electrode Eof the capacitor Cis soldered to the terminal pattern TPexposed from the opening portion OP, and the electrode Eof the capacitor Cis soldered to the terminal pattern TPexposed from the opening portion OP


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