The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Apr. 29, 2019
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Taeyeong Kim, Yongin-si, KR;
Minsoo Han, Hwaseong-si, KR;
Jun Hyung Kim, Yongin-si, KR;
Hoonjoo Na, Seoul, KR;
Kwangjin Moon, Hwaseong-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67092 (2013.01); H01L 21/6838 (2013.01); H01L 21/68735 (2013.01);
Abstract
A substrate bonding apparatus includes a lower chuck that receives a lower substrate and an upper chuck disposed above the lower chuck. An upper substrate is fixed to the upper chuck. The upper chuck and the lower chuck bond the upper substrate to the lower substrate. The upper chuck has an upper convex surface toward the lower chuck. The upper convex surface includes a plurality of first ridges and a plurality of first valleys disposed alternately along an azimuthal direction.