The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Dec. 03, 2019
Applicant:
Sekisui Plastics Co., Ltd., Osaka, JP;
Inventors:
Assignee:
SEKISUI PLASTICS CO., LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 9/18 (2006.01); C08J 9/16 (2006.01); C08J 9/232 (2006.01); C08J 9/14 (2006.01); C08J 9/228 (2006.01);
U.S. Cl.
CPC ...
C08J 9/18 (2013.01); C08J 9/142 (2013.01); C08J 9/16 (2013.01); C08J 9/228 (2013.01); C08J 9/232 (2013.01); C08J 2201/03 (2013.01); C08J 2203/12 (2013.01); C08J 2205/052 (2013.01); C08J 2379/08 (2013.01); C08J 2381/06 (2013.01);
Abstract
Provided is a bead expanded molded article comprising a plurality of resin expanded particles that are fusion-bonded with each other, in which the resin expanded particles mainly include a resin having a glass transition temperature of 180° C. or more.
Quick Actions:
Yamamoto, Hiromaru. (2021). Bead expanded molded article, resin expanded particles, method for producing resin expanded particles, expandable resin particles and method for producing bead expanded molded article (U.S. Patent No. 10947359). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10947359
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile