The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Mar. 25, 2019
Aac Technologies Pte. Ltd., Singapore, SG;
Lieng Loo, Shenzhen, CN;
Shaoquan Wang, Shenzhen, CN;
Xiaohui Zhong, Shenzhen, CN;
Kahkeen Lai, Shenzhen, CN;
AAC Technologies Pte. Ltd., Singapore, SG;
Abstract
The present invention provides a manufacturing method for MEMS structure. The method includes steps of: S: providing a substrate, including a structural layer and a silicon-based layer overlapped with the structural layer; S: carrying out a main etching process for etching out a cavity hole from an end of the silicon-based layer, which is far away from the structural layer, in a direction toward the structural layer until the cavity hole contacts the structural layer; and S: carrying out an over-etching process for deepening the cavity hole and control an included angle α between a side wall of the cavity hole and the structural layer to be larger than 10° but smaller than 90°. The invention also provides a MEMS structural and a MEMS microphone manufactured by the method.