The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Mar. 08, 2016
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Masayuki Hanano, Tokyo, JP;
Masaya Nishiyama, Tokyo, JP;
Yutaka Goh, Tokyo, JP;
Haruaki Sakurai, Tokyo, JP;
Tomohiro Iwano, Tokyo, JP;
Assignee:
Showa Denko Materials Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/00 (2012.01); C09G 1/02 (2006.01); B24B 37/04 (2012.01); C09K 3/14 (2006.01); H01L 21/311 (2006.01); H01L 21/3105 (2006.01); B24B 37/005 (2012.01);
U.S. Cl.
CPC ...
B24B 37/044 (2013.01); B24B 37/00 (2013.01); B24B 37/0056 (2013.01); C09G 1/02 (2013.01); C09K 3/1409 (2013.01); C09K 3/1436 (2013.01); H01L 21/31058 (2013.01); H01L 21/31144 (2013.01);
Abstract
A polishing agent for polishing a resin comprises abrasive grains, a water-soluble polymer having an ether bond, an organic solvent and water, wherein the abrasive grains have a positive charge in the polishing agent and an average particle diameter of the abrasive grains is larger than 20 nm.