The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

Jun. 28, 2018
Applicant:

Globalwafers Co., Ltd., Hsinchu, TW;

Inventors:

Emanuele Corsi, Novara, IT;

Ezio Bovio, Bellinzago Novarese, IT;

Assignee:

GlobalWafers Co., Ltd., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/015 (2012.01); H01L 21/02 (2006.01); B24B 49/14 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
B24B 37/015 (2013.01); B24B 49/14 (2013.01); H01L 21/02024 (2013.01); H01L 22/12 (2013.01); H01L 22/26 (2013.01);
Abstract

A non-transitory computer-readable storage media having computer-executable instructions embodied thereon for operating a polishing assembly for polishing of silicon wafers is provided. When executed by at least one processor, the computer-executable instructions cause the processor to receive thermal data of a portion of a polishing pad from a temperature sensor and determine a removal profile of a silicon wafer based at least in part on the thermal data. The computer-executable instructions cause the processor to operate a polishing head assembly to position the silicon wafer in contact with the polishing pad and to selectively vary the removal profile of the silicon wafer based at least in part on the thermal data.


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