The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2021

Filed:

Apr. 27, 2017
Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventor:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); F28D 20/02 (2006.01); H01L 23/38 (2006.01); H01L 23/427 (2006.01); F28D 15/02 (2006.01); H01L 23/373 (2006.01); H01L 23/367 (2006.01); H01L 21/48 (2006.01); H05K 3/22 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0206 (2013.01); F28D 15/0233 (2013.01); F28D 20/023 (2013.01); H01L 21/4846 (2013.01); H01L 23/3677 (2013.01); H01L 23/3736 (2013.01); H01L 23/38 (2013.01); H01L 23/427 (2013.01); H05K 1/0203 (2013.01); H05K 3/22 (2013.01); H05K 3/4038 (2013.01); H05K 2201/064 (2013.01); H05K 2201/10219 (2013.01); Y02E 60/14 (2013.01);
Abstract

The invention refers to a component carrier realized as a printed circuit board, an intermediate printed circuit board product or an IC-substrate, comprising at least one heat-passage component, said at least one heat-passage component being realized in form of a heat-generating or a heat-absorbing component that is mounted on an outside surface layer or is embedded within at least one inner layer of the component carrier, and further comprising at least one latent-heat storage unit with a phase-change material. The phase-change material is arranged within at least one cavity and integrated within a laminated build-up of the component carrier and is directly thermoconductively coupled with the at least one heat-passage component. The invention also refers to a method for producing said component carrier.


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