The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2021

Filed:

Dec. 14, 2016
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

David Francis Berdy, San Diego, CA (US);

Changhan Hobie Yun, San Diego, CA (US);

Shiqun Gu, San Diego, CA (US);

Niranjan Sunil Mudakatte, San Diego, CA (US);

Mario Francisco Velez, San Diego, CA (US);

Chengjie Zuo, San Diego, CA (US);

Jonghae Kim, San Diego, CA (US);

Assignee:

Qualcomm Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/05 (2006.01); H03H 9/64 (2006.01); H03H 3/08 (2006.01); H03H 9/72 (2006.01); H03H 9/70 (2006.01); H03H 3/02 (2006.01);
U.S. Cl.
CPC ...
H03H 9/0552 (2013.01); H03H 3/02 (2013.01); H03H 3/08 (2013.01); H03H 9/059 (2013.01); H03H 9/0523 (2013.01); H03H 9/0547 (2013.01); H03H 9/0561 (2013.01); H03H 9/0571 (2013.01); H03H 9/0576 (2013.01); H03H 9/64 (2013.01); H03H 9/703 (2013.01); H03H 9/72 (2013.01);
Abstract

An integrated radio frequency (RF) circuit combines complementary features of passive devices and acoustic filters and includes a first die, a second die, and a third die. The first die includes a substrate having one or more passive devices. The second die includes a first acoustic filter. The second die is stacked and coupled to a first surface of the first die. The third die includes a second acoustic filter. The third die is stacked and coupled to a second surface opposite the first surface of the first die.


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