The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2021

Filed:

Apr. 20, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventor:

Hsiang-Wei Lin, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/532 (2006.01); H01L 23/528 (2006.01); H01L 21/311 (2006.01); H01L 21/768 (2006.01); H01L 21/67 (2006.01); H01L 21/764 (2006.01); H01L 23/522 (2006.01); H01L 21/3105 (2006.01); H01L 23/485 (2006.01); H01L 23/00 (2006.01); H01L 23/535 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53238 (2013.01); H01L 21/3105 (2013.01); H01L 21/31111 (2013.01); H01L 21/31144 (2013.01); H01L 21/67063 (2013.01); H01L 21/67115 (2013.01); H01L 21/764 (2013.01); H01L 21/7682 (2013.01); H01L 21/76802 (2013.01); H01L 21/76825 (2013.01); H01L 21/76843 (2013.01); H01L 23/485 (2013.01); H01L 23/522 (2013.01); H01L 23/528 (2013.01); H01L 23/5222 (2013.01); H01L 23/5226 (2013.01); H01L 23/535 (2013.01); H01L 23/5329 (2013.01); H01L 23/53228 (2013.01); H01L 23/53295 (2013.01); H01L 23/564 (2013.01);
Abstract

A semiconductor structure includes a first low-k dielectric layer disposed over a semiconductor substrate, a first conductive feature and a second conductive feature disposed in the first low-k dielectric layer, a second low-k dielectric layer disposed in the first low-k dielectric layer and interposed between the first conductive feature and the second conductive feature, where the second low-k dielectric layer includes an air gap, and an etch-stop layer disposed at an interface between the first low-k dielectric layer and the second low-k dielectric layer. The first low-k dielectric layer includes carbon whose concentration is graded in a direction away from the etch-stop layer.


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