The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2021
Filed:
Aug. 24, 2017
Applicant:
Nexwafe Gmbh, Freiburg, DE;
Inventors:
Stefan Reber, Gundelfingen, DE;
Kai Schillinger, Freiburg, DE;
Assignee:
NexWafe GmbH, Freiburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/02 (2006.01); H01L 31/18 (2006.01); C25F 3/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7813 (2013.01); C25F 3/12 (2013.01); H01L 21/0243 (2013.01); H01L 21/02381 (2013.01); H01L 21/02532 (2013.01); H01L 21/02576 (2013.01); H01L 21/02658 (2013.01); H01L 21/7806 (2013.01); H01L 31/1892 (2013.01); Y02E 10/50 (2013.01);
Abstract
A method for arranging a plurality of semiconductor seed substrates on a carrier element, in which for applying a semiconductor layer to the seed substrates, the seed substrates are arranged on the carrier element by integral bonding. A carrier element having integrally bonded seed substrates for coating with a semiconductor layer is also provided.