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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10943801 B1

PDFFull Text
Date of Patent:
Mar. 09, 2021

Filed:

May. 08, 2018

Laser processing method

Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Koichi Shigematsu, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

Greer Burns & Crain Ltd.

Primary Examiner:

Mouloucoulaye Inoussa

Int. Cl.
CPC ...
H01L 21/67 (2006.01); B23K 26/38 (2014.01); B23K 26/402 (2014.01); H01L 21/683 (2006.01); B23K 26/03 (2006.01); B23K 26/0622 (2014.01); B23K 26/08 (2014.01); B23K 26/364 (2014.01); B23K 103/16 (2006.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67132 (2013.01); B23K 26/032 (2013.01); B23K 26/0622 (2015.10); B23K 26/0853 (2013.01); B23K 26/364 (2015.10); B23K 26/38 (2013.01); B23K 26/402 (2013.01); H01L 21/67092 (2013.01); H01L 21/67115 (2013.01); H01L 21/67259 (2013.01); H01L 21/6836 (2013.01); B23K 2101/40 (2018.08); B23K 2103/172 (2018.08); B23K 2103/56 (2018.08); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01);
Abstract

A laser processing method includes a step of holding a film side of a workpiece which has been divided into chips and whose reverse side carries an adhesive film stuck thereto, a step of detecting widths of grooves in the workpiece at predetermined chip intervals and central coordinates of the widths of the grooves, a step of calculating laser beam irradiation lines based on the detected widths of the grooves and the detected central coordinates, a step of determining misalignment levels of the calculated laser beam irradiation lines according to misalignments of the grooves in widthwise directions thereof, and a step of processing the adhesive film with a laser beam by applying the laser beam to the adhesive film at bottoms of the grooves along the laser beam irradiation lines, thereby separating the adhesive film.

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