The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2021

Filed:

May. 01, 2019
Applicant:

Nxp Usa, Inc., Austin, TX (US);

Inventors:
Assignee:

NXP USA, INC., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 1/42 (2012.01); B23K 26/359 (2014.01); B23K 26/00 (2014.01); G03F 7/20 (2006.01); H01L 21/027 (2006.01); H01L 21/268 (2006.01); H01L 21/78 (2006.01); H01L 23/544 (2006.01); G03F 7/16 (2006.01);
U.S. Cl.
CPC ...
G03F 1/42 (2013.01); B23K 26/0006 (2013.01); B23K 26/359 (2015.10); G03F 7/2022 (2013.01); G03F 7/2024 (2013.01); H01L 21/0274 (2013.01); H01L 21/268 (2013.01); H01L 21/78 (2013.01); H01L 23/544 (2013.01); G03F 7/162 (2013.01); H01L 2223/5446 (2013.01);
Abstract

Optical control modules for integrated circuit device patterning and reticles and methods including the same. The methods include exposing, via a reticle, initial and subsequent reticle exposure fields on a surface of a semiconductor substrate. The initial and subsequent reticle exposure fields pattern corresponding array regions and margin regions on the semiconductor substrate. The initial and subsequent reticle exposure fields partially overlap such that an initial optical control module (OCM), which is patterned during exposure of the initial reticle exposure field, and a subsequent OCM, which is patterned during exposure of the subsequent reticle exposure field, both are positioned within a single control module die. The reticles include reticles that can be utilized during the methods or that can form the integrated circuit devices. The integrated circuit devices include integrated circuit devices formed utilizing the methods or the reticles.


Find Patent Forward Citations

Loading…