The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2021
Filed:
Nov. 28, 2017
Tokyo Ohka Kogyo Co., Ltd., Kawasaki, JP;
National Institute of Advanced Industrial Science and Technology, Tokyo, JP;
Takashi Fujimoto, Kawasaki, JP;
Hidenori Miyamoto, Kawasaki, JP;
Shinji Sugiura, Tsukuba, JP;
Kazumi Shin, Tsukuba, JP;
Fumiki Yanagawa, Tsukuba, JP;
Toshiyuki Kanamori, Tsukuba, JP;
Tokyo Ohka Kogyo Co., Ltd., Kawasaki, JP;
National institute of Advanced Industrial Science and Technology, Tokyo, JP;
Abstract
A method for producing a chip for cell culture that enables production of a microchannel structure, enables mass production at low cost, and also has functions suited to cell culture. The method includes forming a photosensitive adhesive layer by applying a photosensitive adhesive to a first substrate having transparency, thus obtaining a 3D printing substrate, 3D printing steps that employ vat photopolymerization, forming a first adhesive layer by depositing a first adhesive on a second substrate having transparency, thus obtaining a cell culture channel top plate, and bonding the cell culture channel and the cell culture channel top plate together via the first adhesive layer, and then performing thermocompression bonding to obtain a microchannel structural body having a hollow structure, wherein the first adhesive is a polyester-based resin having a Tg value of 5° C. or higher.