The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2021
Filed:
Sep. 01, 2015
Applicant:
Namics Corporation, Niigata, JP;
Inventors:
Tomoya Yamazawa, Niigata, JP;
Haruyuki Yoshii, Niigata, JP;
Assignee:
NAMICS CORPORATION, Niigata, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C09J 163/00 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); C08K 3/22 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/28 (2006.01); C08K 9/06 (2006.01); C08K 3/36 (2006.01);
U.S. Cl.
CPC ...
C08K 9/06 (2013.01); C08K 3/22 (2013.01); C08L 63/00 (2013.01); H01L 21/563 (2013.01); H01L 23/295 (2013.01); H01L 23/3157 (2013.01); H01L 24/13 (2013.01); H01L 24/29 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/014 (2013.01); C09J 163/00 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/3512 (2013.01);
Abstract
Provided is a liquid sealing material for copper bumps which is inhibited from suffering filler separation during thermal curing and thereby causing bump cracking. Also provided is a resin composition for use as the sealing material. The resin composition according to the present invention comprises (A) a liquid epoxy resin, (B) a hardener, and (C) an alumina filler having a surface treated with the silane coupling agent of the following formula (1).