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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10941241 B1

PDFFull Text
Date of Patent:
Mar. 09, 2021

Filed:

Aug. 25, 2016

Epoxy resin molding material, molded product, molded cured product, and method for producing molded cured product

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Kenji Tanaka, Tokyo, JP;

Yuka Yoshida, Tokyo, JP;

Shinichi Kosugi, Tokyo, JP;

Shingo Tanaka, Tokyo, JP;

Hideyuki Katagi, Tokyo, JP;

Haruaki Sue, Tokyo, JP;

Yoshitaka Takezawa, Tokyo, JP;

Assignee:

SHOWA DENKO MATERIALS CO., LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, L.L.P.

Primary Examiner:

David T Karst

Int. Cl.
CPC ...
C08G 59/24 (2006.01); C08G 59/62 (2006.01); C08G 59/68 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
C08G 59/245 (2013.01); C08G 59/621 (2013.01); C08G 59/688 (2013.01); C08K 3/22 (2013.01); C08K 2003/2227 (2013.01);
Abstract

The present disclosure provides: an epoxy resin molding material including; an epoxy resin having a mesogen structure, a phenolic curing agent, an inorganic filler, and a curing accelerator having a quaternary phosphonium cation represented by the following Formula (I); a molded product and a molded cured product using the epoxy resin molding material; and a method for producing a molded cured product. In Formula (I), each of Rto Rindependently represents an alkyl group having from 1 to 6 carbon atoms, or an aryl group, and the alkyl group and the aryl group may have a substituent.

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Tanaka, Kenji. (2021). Epoxy resin molding material, molded product, molded cured product, and method for producing molded cured product (U.S. Patent No. 10941241). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10941241

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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