The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2021

Filed:

Mar. 11, 2019
Applicant:

Nanya Technology Corporation, New Taipei, TW;

Inventors:

Ching-Chia Huang, Taipei, TW;

Tseng-Fu Lu, New Taipei, TW;

Wei-Ming Liao, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/51 (2006.01); H01L 29/78 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 29/516 (2013.01); H01L 29/4236 (2013.01); H01L 29/517 (2013.01); H01L 29/7827 (2013.01);
Abstract

A semiconductor device includes a substrate, at least one trench, an insulating layer, a lower metal layer, a negative capacitance material layer, and an upper metal layer. The trench has an inner surface in the substrate. The insulating layer is disposed on and lining the inner surface of the trench. The lower metal layer is disposed on the insulating layer and partially filling the trench. The negative capacitance material layer is disposed on and lining the insulating layer and the lower metal layer, in which a remained portion of the trench is defined by the negative capacitance material layer. The upper metal layer is disposed on the negative capacitance material layer and filling the remained portion of the trench.


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