The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2021

Filed:

May. 25, 2018
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Kosuke Fukuda, Kumamoto, JP;

Mikio Nakashima, Kumamoto, JP;

Kazuyoshi Shinohara, Kumamoto, JP;

Hiroyuki Higashi, Kumamoto, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67023 (2013.01); H01L 21/6708 (2013.01); H01L 21/67017 (2013.01); H01L 21/67051 (2013.01); H01L 21/67253 (2013.01);
Abstract

A substrate solution-treatment apparatus includes: a substrate holding part for holding a substrate; a nozzle for supplying a treatment solution onto the substrate; a supply line; a flow rate control mechanism including a flow rate meter and a flow rate control valve installed in the supply line; an opening/closing valve installed in the supply line; and a control part for controlling operations of the flow rate control mechanism and the opening/closing valve. The flow rate control mechanism controls the flow rate control valve such that a detection value of the flow rate meter coincides with a flow rate target value provided from the control part. The control part controls the nozzle to supply the treatment solution onto the substrate with the opening/closing valve opened, and provides a first flow rate as the flow rate target value to the flow rate control mechanism.


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