The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2021

Filed:

May. 16, 2018
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Brent Keeth, Boise, ID (US);

James Brian Johnson, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 7/10 (2006.01); G06F 3/06 (2006.01); H01L 23/538 (2006.01); H01L 25/18 (2006.01); G11C 11/4076 (2006.01); G11C 11/4093 (2006.01); G11C 11/4096 (2006.01); G11C 11/22 (2006.01); G06F 11/10 (2006.01); H01L 25/065 (2006.01); H01L 23/50 (2006.01); G11C 5/02 (2006.01); G11C 11/00 (2006.01); H01L 23/14 (2006.01); G11C 11/4097 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0632 (2013.01); G06F 3/0604 (2013.01); G06F 3/0673 (2013.01); G06F 11/1004 (2013.01); G06F 11/1048 (2013.01); G11C 5/025 (2013.01); G11C 11/005 (2013.01); G11C 11/221 (2013.01); G11C 11/2293 (2013.01); G11C 11/4076 (2013.01); G11C 11/4093 (2013.01); G11C 11/4096 (2013.01); H01L 23/50 (2013.01); H01L 23/5386 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); G11C 7/1045 (2013.01); G11C 11/4097 (2013.01); H01L 23/145 (2013.01); H01L 23/147 (2013.01); H01L 23/5384 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01);
Abstract

Techniques are described herein for a reconfigurable memory device that is configurable based on the type of interposer used to couple the memory device with a host device. The reconfigurable memory device may include a plurality components for a plurality of configurations. Various components of the reconfigurable memory die may be activated/deactivated based on what type of interposer is used in the memory device. For example, if a first type of interposer is used (e.g., a high-density interposer), the data channel may be eight data pins wide. In contrast, if second type of interposer is used (e.g., an organic-based interposer), the data channel may be four data pins wide. As such, a reconfigurable memory device may include data pins and related drivers that are inactive in some configurations.


Find Patent Forward Citations

Loading…