The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2021
Filed:
Nov. 09, 2018
Te Connectivity Corporation, Berwyn, PA (US);
Te Connectivity Germany Gmbh, Bensheim, DE;
Tyco Electronics (Shanghai) Co. Ltd., Shanghai, CN;
Shallu Soneja, Fremont, CA (US);
Gokce Gulsoy, Fremont, CA (US);
Yiliang Wu, Fremont, CA (US);
Xiao Zhou, Shanghai, CN;
Helge Schmidt, Bensheim, DE;
Soenke Sachs, Bensheim, DE;
Felix Greiner, Bensheim, DE;
TE Connectivity Corporation, Berwyn, PA (US);
TE Connectivity Germany GmbH, Bensheim, DE;
Tyco Electronics (Shanghai) Co. Ltd., Shanghai, CN;
Abstract
A method of producing a solderable aluminum contact comprises formulating an ink, applying the ink to an aluminum substrate to form an ink layer on a surface of the aluminum substrate, and melting the ink layer. The ink includes a solderable element that is conductive. The melting of the ink layer forms an alloy on the surface of the aluminum substrate including the solderable element.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile