The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2021
Filed:
Aug. 03, 2016
Applicant:
Hewlett-packard Development Company, L.p., Fort Collins, CO (US);
Inventors:
Anthony M Fuller, Corvallis, OR (US);
Terry McMahon, Corvallis, OR (US);
Donald W Schulte, Corvallis, OR (US);
Amy Gault, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01); G01N 27/20 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14072 (2013.01); B41J 2/14153 (2013.01); B41J 2/1601 (2013.01); B41J 2/1629 (2013.01); B41J 2/1634 (2013.01); G01N 27/20 (2013.01);
Abstract
A conductive wire disposed in a layer is described. An example apparatus includes a die including a silicon layer and a first layer coupled to the silicon layer. The example apparatus a conductive wire disposed in the first layer adjacent a perimeter of a location at which a fluid feed slot is to be formed in the silicon layer. The conductive wire has an electrical characteristic that corresponds to whether the fluid feed slot is defective.