The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2021
Filed:
Oct. 07, 2016
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Satoru Wakiyama, Kanagawa, JP;
Kan Shimizu, Kanagawa, JP;
Toshihiko Hayashi, Kanagawa, JP;
Takuya Nakamura, Kumamoto, JP;
Naoki Jyo, Nagasaki, JP;
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Abstract
An imaging device includes a first semiconductor element including at least one bump pad that has a concave shape. The at least one bump pad includes a first metal layer and a second metal layer on the first metal layer. The imaging device includes a second semiconductor element including at least one electrode. The imaging device includes a microbump electrically connecting the at least one bump pad to the at least one electrode. The microbump includes a diffused portion of the second metal layer, and first semiconductor element or the second semiconductor element includes a pixel unit.