The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2021
Filed:
Nov. 30, 2018
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Ming-Hui Yang, New Taipei, TW;
Chun-Ting Liao, Hsinchu, TW;
Yi-Te Chen, Hsinchu, TW;
Chen-Yuan Chen, Hsinchu, TW;
Ho-Chun Liou, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/564 (2013.01); H01L 23/585 (2013.01); H01L 2924/14 (2013.01); H01L 2924/141 (2013.01); H01L 2924/143 (2013.01); H01L 2924/1421 (2013.01);
Abstract
A method of manufacturing a semiconductor device comprises forming an integrated circuit, surrounding the integrated circuit with an inner seal ring, and surrounding the inner seal ring with a closed-loop outer seal ring. The inner seal ring includes a plurality of metal layers in a stacked configuration, first and second seal portions separated from each other, and third and fourth seal portions spaced apart from the first and second seal portions and separated from each other.