The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Dec. 11, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Jennifer Y. Sun, Mountain View, CA (US);

Biraja P. Kanungo, San Jose, CA (US);

Vahid Firouzdor, San Mateo, CA (US);

Ying Zhang, Santa Clara, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); H01L 21/67 (2006.01); B65D 43/02 (2006.01); C23C 4/11 (2016.01); C23C 4/12 (2016.01); C23C 4/04 (2006.01); C23C 4/10 (2016.01); C23C 4/01 (2016.01); C23C 14/00 (2006.01); C23C 4/134 (2016.01); C23C 4/14 (2016.01); C23C 4/16 (2016.01); C23C 14/08 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67023 (2013.01); B65D 43/02 (2013.01); C23C 4/01 (2016.01); C23C 4/04 (2013.01); C23C 4/10 (2013.01); C23C 4/11 (2016.01); C23C 4/12 (2013.01); C23C 4/134 (2016.01); C23C 4/14 (2013.01); C23C 4/16 (2013.01); C23C 14/0015 (2013.01); C23C 14/0021 (2013.01); C23C 14/0031 (2013.01); C23C 14/0036 (2013.01); C23C 14/0052 (2013.01); C23C 14/0084 (2013.01); C23C 14/0094 (2013.01); C23C 14/08 (2013.01); C23C 14/081 (2013.01); C23C 14/083 (2013.01); C23C 14/088 (2013.01); H01J 37/32477 (2013.01); H01J 37/32495 (2013.01); H01J 37/32513 (2013.01); H01J 37/32559 (2013.01); H01L 21/6708 (2013.01); H01L 21/67063 (2013.01); H01L 21/67069 (2013.01); H01L 21/67086 (2013.01); H01J 2237/334 (2013.01); Y10T 428/131 (2015.01); Y10T 428/139 (2015.01); Y10T 428/1317 (2015.01); Y10T 428/1393 (2015.01);
Abstract

A component for a semiconductor processing chamber includes a ceramic body having at least one surface with a first average surface roughness of approximately 8-16 micro-inches. The component further includes a conformal protective layer on at least one surface of the ceramic body, wherein the conformal protective layer is a plasma resistant rare earth oxide film having a substantially uniform thickness of less than 300 μm over the at least one surface and having a second average surface roughness of below 10 micro-inches, wherein the second average surface roughness is less than the first average surface roughness.


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