The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Mar. 18, 2019
Applicant:

Acer Incorporated, New Taipei, TW;

Inventors:

Chun-Chieh Wang, New Taipei, TW;

Wen-Neng Liao, New Taipei, TW;

Cheng-Wen Hsieh, New Taipei, TW;

Wei-Chin Chen, New Taipei, TW;

Jau-Han Ke, New Taipei, TW;

Assignee:

Acer Incorporated, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G06F 1/203 (2013.01); H05K 7/20318 (2013.01); H05K 7/20327 (2013.01); H05K 7/20336 (2013.01);
Abstract

A heat dissipation module including a chamber, a first cooling member, and a barrier part is provided. The chamber has an accommodating space, at least one inlet, and at least one outlet. The at least one inlet is disposed in a first side wall of the chamber and communicates with the accommodating space. The at least one outlet is disposed in a second side wall of the chamber away from the at least one inlet and communicates with the accommodating space. The first cooling member is disposed in the accommodating space. The first cooling member has a guiding surface which extends obliquely upward. The barrier part is disposed outside the guiding surface of the first cooling member and has at least one through hole.


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