The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2021
Filed:
Dec. 28, 2017
Applicant:
Fujifilm Corporation, Tokyo, JP;
Inventor:
Shuji Hirano, Shizuoka, JP;
Assignee:
FUJIFILM Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/038 (2006.01); G03F 7/075 (2006.01); G03F 1/50 (2012.01); C09D 125/18 (2006.01); G03F 7/004 (2006.01); G03F 7/20 (2006.01); G03F 7/00 (2006.01); G03F 7/16 (2006.01); G03F 7/32 (2006.01); C08F 12/24 (2006.01); C08F 212/14 (2006.01); C08F 112/14 (2006.01); C08F 222/10 (2006.01); C08F 220/28 (2006.01); C08F 220/30 (2006.01); C08F 220/24 (2006.01);
U.S. Cl.
CPC ...
G03F 7/038 (2013.01); C08F 12/24 (2013.01); C09D 125/18 (2013.01); G03F 1/50 (2013.01); G03F 7/0046 (2013.01); G03F 7/0382 (2013.01); G03F 7/075 (2013.01); G03F 7/0758 (2013.01); G03F 7/20 (2013.01); C08F 112/14 (2013.01); C08F 212/14 (2013.01); C08F 220/24 (2013.01); C08F 220/281 (2020.02); C08F 220/282 (2020.02); C08F 220/283 (2020.02); C08F 220/301 (2020.02); C08F 220/302 (2020.02); C08F 220/303 (2020.02); C08F 222/10 (2013.01); C08F 222/102 (2020.02); G03F 7/0002 (2013.01); G03F 7/0757 (2013.01); G03F 7/16 (2013.01); G03F 7/322 (2013.01);
Abstract
According to the present invention, an actinic ray-sensitive or radiation-sensitive resin composition including a compound (A) whose dissolution rate in an alkali developer decreases by the action of an acid, a hydrophobic resin (B), and a resin (C) having an aromatic ring, as well as a film, a mask blank, a pattern forming method, and a method for manufacturing an electronic device, each using the composition, are provided.