The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2021
Filed:
Jul. 17, 2019
Te Connectivity Corporation, Berwyn, PA (US);
Bin Lin, Hummelstown, PA (US);
Bernard Wilhelm Vetten, Sunnyvale, CA (US);
Eric DiBiaso, Lebanon, PA (US);
TE CONNECTIVITY CORPORATION, Berwyn, PA (US);
Abstract
A printed circuit board includes a substrate having a plurality of stacked circuit board layers. The substrate has a top surface and a bottom surface. The printed circuit board includes a signal contact on the substrate. The signal contact has a signal via and a signal trace extending from the signal via. The signal via extends between the top surface and the bottom surface along a via axis. The printed circuit board includes an anti-pad around the signal via extending through the substrate along the via axis. The anti-pad extends between the top surface and the bottom surface. The anti-pad has a first width at the top surface and the lower anti-pad has a second width at the bottom surface different than the first width.