The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2021
Filed:
Jun. 05, 2019
Samsung Electronics Co., Ltd., Suwon-si, KR;
Ji Hwang Kim, Chungcheongnam-Do, KR;
Kilsoo Kim, Hwaseong-si, KR;
Jongbo Shim, Asan-si, KR;
Jangwoo Lee, Asan-si, KR;
Eunhee Jung, Hwaseong-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes a substrate, a semiconductor chip mounted on the substrate, an interposer chip on the semiconductor chip and including a redistribution pattern, a first pad on the interposer chip, a second pad on the interposer chip and spaced apart from the first pad, and a bonding wire electrically connected to the second pad and the first substrate. The second pad is electrically connected through the redistribution pattern to the first pad. The footprint of the interposer chip is greater than the footprint of the first semiconductor chip.