The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2021

Filed:

Jul. 27, 2020
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Atsushi Harikai, Osaka, JP;

Noriyuki Matsubara, Osaka, JP;

Shogo Okita, Hyogo, JP;

Hidehiko Karasaki, Hyogo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 21/306 (2006.01); G03F 7/038 (2006.01); G03F 7/40 (2006.01); H01L 21/78 (2006.01); H01L 29/06 (2006.01); H01L 21/311 (2006.01); H01L 21/67 (2006.01); H01L 21/3065 (2006.01); H01L 21/82 (2006.01); H01L 21/3213 (2006.01); H01L 21/02 (2006.01); H01L 21/308 (2006.01); H01L 21/683 (2006.01); H01J 37/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31144 (2013.01); H01J 37/00 (2013.01); H01L 21/02118 (2013.01); H01L 21/02282 (2013.01); H01L 21/3081 (2013.01); H01L 21/30655 (2013.01); H01L 21/31138 (2013.01); H01L 21/32137 (2013.01); H01L 21/67069 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 21/82 (2013.01); H01L 24/14 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/11001 (2013.01); H01L 2224/1301 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01);
Abstract

A manufacturing process of an element chip comprises steps of preparing a substrate including a plurality of etching regions and element regions each containing a plurality of convex and concave portions, holding the substrate and a frame with a holding sheet, forming a protective film by applying a first mixture to form a coated film above the substrate and by drying the coated film to form the protective film along the convex and concave portions, the first mixture containing a water-soluble first resin, water and a water-soluble organic solvent and has a vapor pressure higher than water, removing the protective film by irradiating a laser beam thereon to expose the substrate in the etching regions, plasma-etching the substrate along the etching regions while maintaining the protective film in the element regions to individualize the substrate, and removing the protective film by contacting the protective film with an aqueous rinse solution.


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