The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2021

Filed:

Feb. 20, 2018
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Akihiro Itou, Kyoto, JP;

Atsushi Harikai, Osaka, JP;

Noriyuki Matsubara, Osaka, JP;

Shogo Okita, Hyogo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3065 (2006.01); H01J 37/32 (2006.01); H01L 21/687 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 21/311 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30655 (2013.01); H01J 37/32009 (2013.01); H01J 37/3244 (2013.01); H01J 37/32743 (2013.01); H01L 21/31138 (2013.01); H01L 21/6835 (2013.01); H01L 21/68735 (2013.01); H01L 21/68742 (2013.01); H01L 21/68785 (2013.01); H01L 21/78 (2013.01); H01L 21/7806 (2013.01); H01L 21/67109 (2013.01); H01L 2221/68327 (2013.01);
Abstract

Provided is a manufacturing process of an element chip, which comprises a preparation step, a setting step for setting the substrate on a stage, and a plasma-dicing step for dividing the substrate into a plurality of element chips, wherein the plasma-dicing step is achieved by repeatedly implementing etching routines each including an etching step for etching the second layer along the street regions to form a plurality of grooves and a depositing step for depositing a protective film on inner walls of the grooves, wherein the plasma-dicing step includes a first etching step for forming the grooves each having a first scallop on the inner wall thereof at a first pitch, and a second etching step for forming the grooves each having a second scallop on the inner wall thereof at a second pitch, and wherein the second pitch is greater than the first pitch.


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