The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2021

Filed:

Jun. 27, 2019
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Mark Carbone, Cupertino, CA (US);

Juha Tapani Paavola, Hillsboro, OR (US);

Nicholas R. Weber, Beaverton, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); H05K 7/20 (2006.01); G06F 1/16 (2006.01);
U.S. Cl.
CPC ...
G06F 1/203 (2013.01); G06F 1/1616 (2013.01); H05K 7/20145 (2013.01); H05K 7/20154 (2013.01); H05K 7/20172 (2013.01); H05K 7/20336 (2013.01); G06F 2200/201 (2013.01);
Abstract

Particular embodiments described herein provide for an electronic device that can be configured to include one or more heat sources, a heat pipe embedded in a chassis of the electronic device, where the heat pipe is thermally coupled to the one or more heat sources to collect heat from the one or more heat sources, and a thermal cooling device, where the thermal cooling device is thermally coupled to the heat pipe and can dissipate heat collected from the heat pipe using air from outside the chassis. In an example, the heat pipe is an oscillating heat pipe and has a thickness between about two (2) millimeters to about twelve (12) millimeters.


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