The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2021
Filed:
Mar. 28, 2017
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Jung Hak Kim, Daejeon, KR;
Hee Jung Kim, Daejeon, KR;
Seung Hee Nam, Daejeon, KR;
Kwang Joo Lee, Daejeon, KR;
Se Ra Kim, Daejeon, KR;
Young Kook Kim, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/14 (2006.01); C09J 7/10 (2018.01); C09J 7/30 (2018.01); C09J 11/06 (2006.01); C09J 11/04 (2006.01); C09J 133/08 (2006.01); C09J 133/10 (2006.01); C09J 163/00 (2006.01); C09J 163/04 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); C08G 59/62 (2006.01);
U.S. Cl.
CPC ...
C09J 7/10 (2018.01); C08G 59/621 (2013.01); C09J 7/30 (2018.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 133/08 (2013.01); C09J 163/00 (2013.01); C09J 163/04 (2013.01); H01L 23/14 (2013.01); H01L 23/49513 (2013.01); H01L 24/00 (2013.01); C09J 133/10 (2013.01); C09J 2203/326 (2013.01); C09J 2301/312 (2020.08); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01);
Abstract
The present invention relates to a semiconductor device including: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies a predetermined ratio between a melt viscosity and a weight loss ratio at a high temperature.