The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2021
Filed:
Jan. 17, 2019
Applicant:
Taiwan Union Technology Corporation, Chupei, TW;
Inventors:
Ju-Ming Huang, Chupei, TW;
Chen-Hua Yu, Chupei, TW;
Chang-Chien Yang, Chupei, TW;
Guan-Syun Tseng, Chupei, TW;
Chih-Wei Liao, Chupei, TW;
Assignee:
TAIWAN UNION TECHNOLOGY CORPORATION, Chupei, TW;
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/06 (2006.01); C08G 59/30 (2006.01); C08G 59/26 (2006.01); C08G 59/28 (2006.01); C08K 5/00 (2006.01); C08K 5/5397 (2006.01); C08J 5/24 (2006.01); H05K 3/00 (2006.01); C08K 5/5399 (2006.01); C08K 3/013 (2018.01);
U.S. Cl.
CPC ...
C08G 59/06 (2013.01); C08G 59/26 (2013.01); C08G 59/28 (2013.01); C08G 59/308 (2013.01); C08J 5/24 (2013.01); C08K 5/0066 (2013.01); C08K 5/5397 (2013.01); C08K 5/5399 (2013.01); H05K 3/0064 (2013.01); C08K 3/013 (2018.01); H05K 2203/06 (2013.01);
Abstract
A thermal-curable resin composition is provided. The thermal-curable resin composition comprises:
Huang, Ju-Ming. (2021). Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the same (U.S. Patent No. 10920008). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10920008
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile