The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2021

Filed:

Dec. 29, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Sumita Basu, Portland, OR (US);

Shantanu D. Kulkarni, Hillsboro, OR (US);

Prosenjit Ghosh, Portland, OR (US);

Konstantin I. Kouliachev, Olympia, WA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28D 15/02 (2006.01); G06F 1/20 (2006.01); H05K 1/02 (2006.01); H01L 21/48 (2006.01); H01L 23/427 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); F28D 15/04 (2006.01); F28F 13/16 (2006.01); F28C 3/08 (2006.01); G06F 1/16 (2006.01); H05K 5/00 (2006.01); F28D 21/00 (2006.01); F21V 8/00 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20336 (2013.01); F28C 3/08 (2013.01); F28D 15/025 (2013.01); F28D 15/0233 (2013.01); F28D 15/0266 (2013.01); F28D 15/0275 (2013.01); F28D 15/0283 (2013.01); F28D 15/046 (2013.01); F28F 13/16 (2013.01); G06F 1/1601 (2013.01); G06F 1/20 (2013.01); G06F 1/203 (2013.01); H01L 21/4846 (2013.01); H01L 21/4871 (2013.01); H01L 23/427 (2013.01); H01L 23/5389 (2013.01); H05K 1/0203 (2013.01); H05K 1/0272 (2013.01); H05K 1/185 (2013.01); H05K 3/0017 (2013.01); H05K 3/0044 (2013.01); H05K 5/0017 (2013.01); H05K 7/20318 (2013.01); H05K 7/20809 (2013.01); F28D 2015/0225 (2013.01); F28D 2021/0029 (2013.01); F28F 2215/06 (2013.01); G02B 6/0085 (2013.01); G02F 1/133385 (2013.01); H05K 2201/064 (2013.01);
Abstract

A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in rack servers are disclosed. An example embodiment includes: a base structure; and a rack column supported by the base structure, the rack column in thermal coupling with a heat-generating device, the rack column containing a constrained vapor bubble (CVB) cell cluster including a plurality of cells in thermal coupling with the heat-generating device at a first end in an evaporator region and in thermal coupling with the base structure at a second end in a condenser region, each cell of the plurality of cells having a wickless capillary driven CVB heat pipe embedded in the cell, each wickless capillary driven CVB heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between the evaporator region and the condenser region.


Find Patent Forward Citations

Loading…