The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2021

Filed:

Aug. 21, 2019
Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Tasuku Koyanagi, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0093 (2020.05); H01L 33/007 (2013.01); H01L 33/0095 (2013.01);
Abstract

An optical device wafer processing method for transferring an optical device layer of an optical device wafer onto a transfer member includes: a dividing groove forming step of forming dividing grooves in a buffer layer; a transfer member joining step of joining the transfer member to a front surface of the optical device layer; and a laser beam applying step of applying a pulsed laser beam from a back surface side of a crystalline substrate. In the laser beam applying step, the buffer layer, or the buffer layer and part of the optical device layer, left without being divided in the dividing groove forming step, are modified in nature.


Find Patent Forward Citations

Koyanagi, Tasuku. (2021). Optical device wafer processing method (U.S. Patent No. 10916679). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10916679

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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