The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2021
Filed:
Sep. 04, 2018
Applicant:
Fuji Electric Co., Ltd., Kawasaki, JP;
Inventors:
Ryoichi Kato, Matsumoto, JP;
Kohei Yamauchi, Matsumoto, JP;
Hiromichi Gohara, Matsumoto, JP;
Tatsuhiko Asai, Hino, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/492 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 29/739 (2006.01); H01L 23/36 (2006.01); H01L 23/498 (2006.01); H01L 23/04 (2006.01); H01L 23/373 (2006.01); H01L 23/24 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49562 (2013.01); H01L 23/041 (2013.01); H01L 23/24 (2013.01); H01L 23/36 (2013.01); H01L 23/367 (2013.01); H01L 23/3735 (2013.01); H01L 23/3737 (2013.01); H01L 23/492 (2013.01); H01L 23/49844 (2013.01); H01L 24/29 (2013.01); H01L 24/69 (2013.01); H01L 24/84 (2013.01); H01L 29/7393 (2013.01); H01L 24/32 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/73 (2013.01); H01L 29/7395 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/3716 (2013.01); H01L 2224/37124 (2013.01); H01L 2224/37139 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40225 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/84801 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract
A semiconductor module includes a semiconductor element having one and the other surface, a lead terminal connected electrically and thermally to the semiconductor element, a first solder which bonds the lead terminal and the one surface of the semiconductor element together, a circuit layer over which the semiconductor element is disposed and a second solder which bonds the other surface of the semiconductor element and the circuit layer together. The inequality()<1