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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10913248 B1

PDFFull Text
Date of Patent:
Feb. 09, 2021

Filed:

Nov. 24, 2016

Method for manufacturing electronic component, resin composition for temporary fixing, resin film for temporary fixing, and resin film sheet for temporary fixing

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Tatsuya Makino, Tokyo, JP;

Shogo Sobue, Tokyo, JP;

Takahiro Tokuyasu, Tokyo, JP;

Manabu Ishii, Tokyo, JP;

Assignee:

Showa Denko Materials Co., Ltd., Tokyo, JP;

Attorney:

Merchant & Gould, P.C.

Primary Examiner:

Michael C Miggins

Int. Cl.
CPC ...
B32B 27/08 (2006.01); H01L 21/02 (2006.01); H01L 21/304 (2006.01); C09D 133/08 (2006.01); C09D 133/06 (2006.01); H01L 21/683 (2006.01); B32B 27/30 (2006.01); C08K 5/3445 (2006.01); C08L 33/10 (2006.01); C08L 83/04 (2006.01); C08K 5/14 (2006.01); C08K 5/00 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B32B 27/308 (2013.01); C08K 5/3445 (2013.01); C08L 33/10 (2013.01); C08L 83/04 (2013.01); C09D 133/066 (2013.01); C09D 133/08 (2013.01); H01L 21/02057 (2013.01); H01L 21/304 (2013.01); H01L 21/683 (2013.01); H01L 21/6835 (2013.01); C08K 5/0025 (2013.01); C08K 5/14 (2013.01); C08L 2203/20 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2221/68386 (2013.01); H01L 2224/03002 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01);
Abstract

A method for manufacturing an electronic component, includes: a step of temporarily fixing onto a support body a workpiece to become a member constituting an electronic component, via a film-like temporary fixing material; a step of processing the workpiece which is temporarily fixed onto the support body; and a step of separating the processed workpiece from the support body and the film-like temporary fixing material, and the film-like temporary fixing material contains an (meth)acrylic copolymer (A) having a not unevenly distributed reactive functional group.

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