The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2021

Filed:

Jun. 09, 2017
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Cheng-Ling Huang, Kaohsiung, TW;

Ying-Chung Chen, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/16 (2006.01); A61B 5/00 (2006.01); A61B 5/0408 (2006.01); H01L 31/0203 (2014.01);
U.S. Cl.
CPC ...
H01L 31/16 (2013.01); A61B 5/0082 (2013.01); A61B 5/0408 (2013.01); H01L 31/0203 (2013.01); A61B 2562/0209 (2013.01); A61B 2562/0238 (2013.01); A61B 2562/06 (2013.01); A61B 2562/185 (2013.01);
Abstract

A semiconductor package device comprises a substrate, a light emitter, a light detector and a transparent conductive film. The substrate as a first surface and a second surface opposite to the first surface. The light emitter is disposed on the first surface of the substrate and has a light emission area adjacent to the first surface of the substrate. The light detector is disposed on the first surface of the substrate and has a light receiving area adjacent to the first surface of the substrate. The transparent conducting film is disposed on the second surface of the substrate.


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