The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
Mar. 08, 2019
Applicant:
Globalwafers Co., Ltd., Hsinchu, TW;
Inventors:
Justin Scott Kayser, Wentzville, MO (US);
John Francis Valley, Lake Oswego, OR (US);
James Dean Eoff, Montgomery City, MO (US);
Assignee:
GlobalWafers Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/78 (2006.01); H01L 21/67 (2006.01); H01L 21/762 (2006.01); B28D 5/00 (2006.01); B32B 43/00 (2006.01);
U.S. Cl.
CPC ...
H01L 22/10 (2013.01); B28D 5/0005 (2013.01); B28D 5/0064 (2013.01); B32B 43/006 (2013.01); H01L 21/67092 (2013.01); H01L 21/67253 (2013.01); H01L 21/76251 (2013.01); H01L 21/76254 (2013.01); H01L 21/7806 (2013.01); B32B 2457/14 (2013.01);
Abstract
Cleave systems for separating bonded wafer structures, mountable cleave monitoring systems and methods for separating bonded wafer structures are disclosed. In some embodiments, the sound emitted from a bonded wafer structure is sensed during cleaving and a metric related to an attribute of the cleave is generated. The generated metric may be used for quality control and/or to adjust a cleave control parameter to improve the quality of the cleave of subsequently cleaved bonded wafer structures.