The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
Sep. 06, 2013
Applicant:
Soitec, Crolles, FR;
Inventors:
Fabrice Letertre, Grenoble, FR;
Oleg Kononchuk, Grenoble, FR;
Assignee:
Soitec, Crolles, FR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); B32B 7/12 (2006.01); B32B 9/04 (2006.01); B32B 38/00 (2006.01); C30B 29/68 (2006.01); C30B 33/00 (2006.01); H01L 21/18 (2006.01); H01L 21/02 (2006.01); C30B 33/06 (2006.01); H01L 27/12 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 21/76251 (2013.01); B32B 7/12 (2013.01); B32B 9/04 (2013.01); C30B 29/68 (2013.01); C30B 33/00 (2013.01); C30B 33/06 (2013.01); H01L 21/02002 (2013.01); H01L 21/185 (2013.01); H01L 27/1203 (2013.01); B32B 2457/14 (2013.01); H01L 33/0093 (2020.05); Y10T 156/1062 (2015.01); Y10T 428/24942 (2015.01);
Abstract
The invention relates to a method for fabricating a pseudo-substrate comprising the steps of providing a single crystal ingot, providing a handle substrate, cutting a thin slice from the single crystal ingot, and attaching the thin slice to the handle substrate to form a pseudo-substrate. According to the invention, the thickness of the thin slice is substantially equal or inferior to a critical thickness below which the slice, if taken alone, is no longer mechanically stable. The invention further relates to a semiconductor structure.