The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2021

Filed:

Jul. 13, 2017
Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Kenta Chito, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/677 (2006.01); H01L 21/67 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67259 (2013.01); H01J 37/32009 (2013.01); H01J 37/32697 (2013.01); H01J 37/32715 (2013.01); H01J 37/32733 (2013.01); H01J 37/32935 (2013.01); H01L 21/67069 (2013.01); H01L 21/67742 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); H01J 2237/334 (2013.01);
Abstract

Disclosed herein is a hold checking method for checking whether or not a wafer is held by an electrostatic chuck in loading the wafer to the electrostatic chuck by operating a transfer unit holding the wafer. The hold checking method includes a connecting step of bringing the wafer held by a transfer pad into contact with the electrostatic chuck to thereby connect the transfer pad through the wafer to the electrostatic chuck, and a hold determining step of supplying electric power from a DC power source through first wiring to the electrostatic chuck after performing the connecting step, and next determining that the wafer is held by the electrostatic chuck when the voltage across a resistor inserted in the first wiring has reached a predetermined voltage value.


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