The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Oct. 21, 2016
Applicant:

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventors:

Gernot Grober, Graz, AT;

Sabine Liebfahrt, Parschlug, AT;

Marco Gavagnin, Leoben, AT;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4614 (2013.01); H05K 1/0271 (2013.01); H05K 1/185 (2013.01); H05K 3/4694 (2013.01); H05K 3/4697 (2013.01); H05K 1/0237 (2013.01); H05K 1/14 (2013.01); H05K 3/36 (2013.01); H05K 2201/048 (2013.01); H05K 2201/086 (2013.01); H05K 2201/09136 (2013.01); H05K 2201/09163 (2013.01);
Abstract

A method of manufacturing a component carrier is disclosed. The method includes providing a first component carrier body having at least one first electrically insulating layer structure and at least one first electrically conductive layer structure, providing a second component carrier body having at least one second electrically insulating layer structure and at least one second electrically conductive layer structure, providing at least a part of at least one of the first component carrier body and the second component carrier body of an at least partially uncured material, and interconnecting the first component carrier body with the second component carrier body by curing the at least partially uncured material.


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