The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Mar. 18, 2019
Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventor:

Hirotaka Taniguchi, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 13/10 (2006.01); H05K 3/00 (2006.01); H01Q 1/38 (2006.01); H05K 3/46 (2006.01); H05K 3/42 (2006.01); H05K 3/10 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H01Q 13/10 (2013.01); H01Q 1/38 (2013.01); H05K 3/0029 (2013.01); H05K 3/0032 (2013.01); H05K 3/0044 (2013.01); H05K 3/06 (2013.01); H05K 3/108 (2013.01); H05K 3/428 (2013.01); H05K 3/4652 (2013.01); H05K 2203/0195 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0723 (2013.01);
Abstract

A printed wiring board includes a laminated structure including insulating layers, and conductive layers laminated on the insulating layer, respectively, such that the conductive layers include an outermost conductive layer having a radiation slot, and an inner-side conductive layer having an excitation portion facing the radiation slot in a lamination direction. The laminated structure has a recess portion recessed from the radiation slot toward the excitation portion such that a bottom surface of the recess portion is positioned between the outermost conductive layer and the excitation portion, and the insulating layers include an insulating layer having at least a portion covering the excitation portion.


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