The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Jan. 07, 2016
Applicants:

Lawrence Livermore National Security, Llc, Livermore, CA (US);

The Regents of the University of California, Oakland, CA (US);

Inventors:

Adam Conway, Livermore, CA (US);

Sara Elizabeth Harrison, Fremont, CA (US);

Rebecca J. Nikolic, Oakland, CA (US);

Qinghui Shao, Fremont, CA (US);

Lars Voss, Livermore, CA (US);

Srabanti Chowdhury, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/808 (2006.01); H01L 29/10 (2006.01); H01L 29/20 (2006.01); H01L 29/06 (2006.01); H01L 29/16 (2006.01); H01L 29/812 (2006.01); H01L 29/778 (2006.01); H01L 29/66 (2006.01); H01L 29/04 (2006.01);
U.S. Cl.
CPC ...
H01L 29/8083 (2013.01); H01L 29/0649 (2013.01); H01L 29/0657 (2013.01); H01L 29/1066 (2013.01); H01L 29/1095 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H01L 29/66068 (2013.01); H01L 29/66924 (2013.01); H01L 29/7788 (2013.01); H01L 29/7789 (2013.01); H01L 29/8122 (2013.01); H01L 29/045 (2013.01);
Abstract

According to one embodiment, an apparatus includes a substrate, and at least one three dimensional (3D) structure above the substrate. The substrate and the 3D structure each include a semiconductor material. The 3D structure also includes: a first region having a first conductivity type, and a second region coupled to a portion of at least one vertical sidewall of the 3D structure.


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