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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10903168 B1

PDFFull Text
Date of Patent:
Jan. 26, 2021

Filed:

May. 29, 2020

Multi-rdl structure packages and methods of fabricating the same

Applicant:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Inventors:

Milind S. Bhagavat, Broomfield, CO (US);

Lei Fu, Austin, TX (US);

Farshad Ghahghahi, San Jose, CA (US);

Assignee:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:

Caleen O Sullivan

Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 25/16 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 21/4857 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 25/0655 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/211 (2013.01); H01L 2224/24137 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3511 (2013.01);
Abstract

Various arrangements of multi-RDL structure devices are disclosed. In one aspect, an apparatus is provided that includes a first redistribution layer structure and a second redistribution layer structure mounted on the first redistribution layer structure. A first semiconductor chip is mounted on the second redistribution layer structure and electrically connected to both the second redistribution layer structure and the first redistribution layer structure.

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Bhagavat, Milind. (2021). Multi-rdl structure packages and methods of fabricating the same (U.S. Patent No. 10903168). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10903168

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