Flip chip bonding device and bonding method

Abstract

A flip-chip bonding device and method are disclosed. The bonding device includes: a supply unit () for separating a flip-chip () from a carrier () and providing the flip-chip (), the supply unit () including flipping device (); a transfer unit () for receiving the flip-chip () from the flipping device (); a position adjustment unit () for adjusting the positions of flip-chips () on the transfer unit (); a bonding unit () for bonding the flip-chips () on the transfer unit () onto a substrate (); a transportation unit () for transporting the transfer unit (); and a control unit () for controlling the movement of the preceding units. The transfer unit () is capable of receiving multiple flip-chips () and allows the flip-chips () to be bonded simultaneously. This can result in savings in bonding time and an improvement in throughput. Moreover, during the transportation of the transfer unit (), the positions of the flip-chips () thereon can be adjusted by the position adjustment unit (), thereby ensuring high positional accuracy of the flip-chips () in the subsequent bonding step. As a result, a high-accuracy bonding can be achieved.