The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Oct. 11, 2019
Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Hiroshi Morikazu, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/42 (2006.01); H01L 21/428 (2006.01);
U.S. Cl.
CPC ...
H01L 21/428 (2013.01);
Abstract

A laser processing method for processing a substrate having a device formed on the front side, an electrode pad being formed on the device. The method includes applying a pulsed laser beam to the back side of the substrate at a position corresponding to the electrode pad, thereby forming a fine hole in the substrate so that the fine hole reaches the electrode pad, detecting first plasma light generated from the substrate by the application of the pulsed laser beam to the substrate and also detecting second plasma light generated from the electrode pad by the application of the pulsed laser beam to the electrode pad, and stopping the laser beam when the second plasma light is detected. Time intervals of the pulsed laser beam repeatedly applied to the same fine hole are set to 0.1 ms or more.


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